پلی آمید 66 / FCN-ADDED
KOPLA PA66 |
SORT |
FCN ADDED |
||||
NEW |
KDG1133CR |
KDG1030ST |
||||
OLD |
- |
- |
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Properties |
Test Method (ASTM) |
Condition |
unit |
GF & CR CaCl2 Resistance |
GF & ST SEEThroughness |
|
Specific Gravity |
D792 |
- |
- |
1.37 |
1.37 |
|
Water Absorption |
D570 |
23°C, Water, 24h |
% |
0.2 |
0.8 |
|
Poisson's Ratio |
D638 |
23°C |
- |
0.38 |
0.38 |
|
Molding Shrinkage(1/8') |
D955 |
Flow |
% |
0.3-0.7 |
0.3-0.7 |
|
Xflow |
% |
0.6-1.0 |
0.6-1.0 |
|||
Melting Point |
DSC Method |
- |
°C |
225/260 |
260 |
|
Heat Deflection Temperature |
D648 |
4.6kgf/cm² |
°C |
225 |
260 |
|
18.6kgf/cm² |
°C |
240 |
255 |
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Coefficient of Linear Thermal Expansion |
D696 |
- |
X10-5l/K |
2.5 |
2.5 |
|
Tensile Strength |
D638 |
23°C(RH0/RH50) |
Mpa |
185/130 |
190/135 |
|
Tensile Modulus |
D639 |
23°C(RH0/RH50) |
Mpa |
10500/7800 |
10000/7500 |
|
Tensile Elongation |
D638 |
23°C(RH0/RH50) |
% |
3/4 |
3/4 |
|
Flexural Strength |
D790 |
23°C(RH0/RH50) |
Mpa |
250/165 |
260/175 |
|
Flexural Modulus |
D790 |
23°C(RH0/RH50) |
Mpa |
8500/6000 |
8200/5900 |
|
Izod Impact Strength |
D256 |
Notched(RH0/RH50) |
Mpa |
15/18 |
11/16 |
|
Rockwell Hardness |
D785 |
R-scale(RH0/RH50) |
kJ/M^2 |
120/115 |
120/115 |
|
Flammability |
UL94 |
32MM |
- |
HB |
HB |
|
Dielectric Constant |
D150 |
10^6Hz |
- |
3.7 |
3.7 |
|
Dielectric Dissipation Factor |
D150 |
10^6Hz |
- |
0.01 |
0.01 |
|
Volume Resistivity |
D257 |
- |
Ω·CM |
1*10^15 |
1*10^15 |
|
Dielectric Strength |
D149 |
- |
KV/mm m |
32 |
32 |